In this Q&A, you will learn about some of the technologies and techniques that are making it possible to address advanced packaging challenges.

When is it worth destroying a device to understand it? This article examines how destructive physical analysis resolves structural uncertainty in FA.

As AI data centers drive up electricity prices, London-based startup Tem thinks AI might be able to help solve it, too. Tem has built an energy transaction engine that relies on AI to cut prices ...

This population-based nested case-control study analyzed data from the Korean National Health Insurance Corporation (2002–2019). Adults aged ≥19 years with at least three years of recorded claims were ...

Student evaluations of teaching (SET) are a popular measure of teaching effectiveness, which center students’ perspectives. However, research shows that SET scores have limitations, including ...

“You cannot outrun your life on fire,” writes political journalist — and recent tabloid darling — Olivia Nuzzi in the opening pages of her much-anticipated memoir, “American Canto.” In writing ...

Thought LeaderDr. Stuart RobertsonSenior Electron MicroscopistLoughborough Materials Characterization Centre In this interview, AZoMaterials speaks with Dr. Stuart Robertson, Senior Electron ...

TEM lamella preparation is essential for almost any FIB-SEM user. Go beyond conventional TEM sample preparation with the ZEISS Crossbeam FIB-SEM. Users can maximize their productivity for TEM lamella ...