After an underwhelming end to last year, Micron Technology Inc. shares have been hot to start 2025, rising 18% to lead S&P ...

The US semiconductor company has commenced construction on a new high-bandwidth memory advanced packaging facility.

Micron (MU) broke ground on a new high-bandwidth memory advanced packaging facility adjacent to the company’s current facilities in Singapore.

Highlights,Micron Technology begins construction on a new High-Bandwidth Memory (HBM) advanced packaging facility in ...

Micron Technology (MU) said it broke ground on a new High-Bandwidth Memory, or HBM, advanced packaging facility in Singapore.

It's Singapore's first facility dealing with HBM, part of the AI chips that's powering companies like Nvidia and TSMC to new ...

Micron Technology Inc. is investing $7 billion over the next several years to expand its manufacturing footprint in Singapore ...

Supermicro (SMCI) begins volume shipments of max-performance servers optimized for AI, HPC, and high GPU demands, including ...

Micron Technology initiated construction on (January 8, 2025) of a new High-Bandwidth Memory (HBM) advanced packaging ...

Set to start operating in 2026, the plant will be used to package high-bandwidth memory chips, a type widely seen in AI data ...

Explore the NVIDIA GeForce RTX 5090: unmatched power, advanced cooling, and next-gen connectivity for gamers and ...

Talk about artificial intelligence and you immediately think about Nvidia (NASDAQ:NVDA), Broadcom (NASDAQ:AVGO), or even ...