After an underwhelming end to last year, Micron Technology Inc. shares have been hot to start 2025, rising 18% to lead S&P ...

The US semiconductor company has commenced construction on a new high-bandwidth memory advanced packaging facility.

Micron (MU) broke ground on a new high-bandwidth memory advanced packaging facility adjacent to the company’s current facilities in Singapore.

Micron Technology, Inc. (NASDAQ:MU) broke ground on a new High-Bandwidth Memory (HBM) advanced packaging facility near the ...

Micron Technology (MU) said it broke ground on a new High-Bandwidth Memory, or HBM, advanced packaging facility in Singapore.

Micron Technology Inc. is investing $7 billion over the next several years to expand its manufacturing footprint in Singapore ...

Supermicro (SMCI) begins volume shipments of max-performance servers optimized for AI, HPC, and high GPU demands, including ...

Micron Technology initiated construction on (January 8, 2025) of a new High-Bandwidth Memory (HBM) advanced packaging ...

Set to start operating in 2026, the plant will be used to package high-bandwidth memory chips, a type widely seen in AI data ...

Explore the NVIDIA GeForce RTX 5090: unmatched power, advanced cooling, and next-gen connectivity for gamers and ...

Talk about artificial intelligence and you immediately think about Nvidia (NASDAQ:NVDA), Broadcom (NASDAQ:AVGO), or even ...

Nvidia’s CEO Jensen Huang expressed confidence that Samsung will overcome challenges in producing high-bandwidth memory chips ...