How AI is reshaping EDA, and how it will help chipmakers to focus on domain-specific solutions.

An new technical paper titled “Fast and Accurate Jitter Modeling for Statistical BER Analysis for Chiplet Interconnect and ...

A new technical paper titled “Research Challenges and Progress in the End-to-End V2X Cooperative Autonomous Driving ...

Abhi agreed. “We have to trust in that hallucination, that innovation to provide us with things that we’ve never seen before, ...

Bandwidth, Compute, Synchronization, and Capacity are all you need” was published by NVIDIA. Abstract “This paper presents a ...

Every aspect of data center energy use must be optimized to reduce power consumption and enable more sustainability, from ...

The development of a semiconductor system is more complex than just describing functionality in RTL. How ready are AI models ...

A new technical paper titled “Advanced Optical Integration Processes for Photonic-Integrated Circuit Packaging” was published ...

Contemporary AI, high-performance computing (HPC), mobile, and automotive designs continue to grow in size and complexity, ...

Acceleration of Large Language Models with Mixture of Experts via 3D Heterogeneous Integration” was published by researchers ...

A structured approach ensures consistent IP metadata representation across abstraction levels, design tools, and development ...

A new technical paper titled “Hybrid Bonding with Polymeric Interlayer Dielectric Layers Patterned by Nanoimprint Lithography ...