In advanced semiconductor manufacturing, inspection and FA are not overhead—they are economic control mechanisms that protect ...

Not all defects are visible with the same microscope. Explore how resolution, contrast, and signal interpretation shape semiconductor failure investigations.

Failure analysis (FA) is an essential step for achieving sufficient yield in semiconductor manufacturing, but it’s struggling to keep pace with smaller dimensions, advanced packaging, and new power ...

When contamination defects surface in advanced nodes, the root cause often spans tools, materials, and handling. This piece outlines how defect mapping, TEM, and SPC data converge to prove causation.

Two expectations informed end-users have of electric motor service centers are reliable best practice repairs and root cause failure analysis (RCFA) to prevent recurring failures. Service centers ...

They can image a wide range of materials and biological samples with high magnification, resolution, and depth of field, thereby revealing surface structure and chemical composition. Industries like ...

Experts at the Table: Semiconductor Engineering sat down to discuss traceability and the lack of data needed to perform root cause analysis with Frank Chen, director of applications and product ...

The Committee on Analysis of Causes of Failure and Collapse of the 305-Meter Telescope at the Arecibo Observatory of the National Academies of Sciences, Engineering, and Medicine was asked to review ...