Air bubbles pose a significant risk in sensor encapsulation, potentially compromising protection and reliability. Master Bond addressed this by implementing rigorous degassing protocols prior to ...
The EP112LS is a two-component epoxy ideally suited for impregnation, potting, encapsulation, sealing and coating applications, especially in the aerospace and optoelectronics industries. The EP112LS ...
One of Master Bond’s customers had a need for an optically clear adhesive that could form a strong structural bond. To make their application process easier, it required a compound with a long working ...
Widely used for applications in the aerospace, electronic and OEM industries, Master Bond EP121CL-LO is a high performance epoxy that passes ASTM E595 testing for NASA low outgassing specifications.
Infused with nanosilica, this two-component epoxy system from Master Bond is suitable for potting, coating and sealing applications. EP114’s nanoparticles are designed for dimensional stability, ...