The 300mm silicon carbide wafer targets higher production capacity for power electronics and advanced system integration.

This study constitutes a demonstration of highly textured, large-area perovskite photodiodes integrated sturdily onto ...

In the race to develop the next generation of high-performance semiconductor devices, thermal management has emerged as a critical bottleneck. From AI accelerators in hyperscale data centers to RF ...

Researchers at Kumamoto University have now demonstrated a simple and effective way to control the handedness of an inorganic ...

For more than two decades, the International Space Station has provided a platform for growing and studying protein crystals. In the early days of microgravity research, scientists discovered that ...

Copper (Cu) foil, with its exceptional electrical and thermal conductivity, serves as a foundational material for integrated circuits, high-frequency communication, and advanced energy technologies.

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