You invest millions into a sleek new wearable, only for the first units to reach customers scuffed, dented, or wrapped in non ...

Most of us use our cell phones, smart watches and other electronic devices without giving much thought to the components and how they fit and work together. But it’s a complex problem that ...

Some of the world's most advanced research in micro- and nanoelectronic-packaging reliability is taking place in the Electronic Packaging Laboratory in the UB School of Engineering and Applied ...

Modeling and simulation is an efficient way of analyzing packaging and testing processes to develop a strong understanding of how they may impact designs and performance. Multiphysics simulation ...

Electronic packaging encapsulates intricate systems whose reliability is critically affected by moisture diffusion and the resultant delamination at material interfaces. As water molecules permeate ...

Chip Packaging Blurs Lines Between IC Fabrication And Test The key to packaging innovation often lies with production, where making component packages smaller may be inherently linked with making them ...

“Thermal metamaterials exhibit thermal properties that do not exist in nature but can be rationally designed to offer unique capabilities of controlling heat transfer. Recent advances have ...

The field of electronics, particularly integrated circuit (IC) technology, has advanced rapidly in recent years. With the development of 5G/6G mobile technology, semiconductor devices are evolving to ...

Electronic Vehicles (EVs) have been at the center of attention in recent years. With the automotive industry becoming more aligned with sustainable development goals, the focus has shifted toward EVs ...

Austin-based 3M Microelectronic Project today said it has developed technology that it claims will double the performance of high-end opto-electronic packages. The company, a division of St. Paul, ...

In a recent article published in Molecules, researchers evaluated the synergistic effect of Aluminum Nitride (AlN) and Carbon Nanotubes (CNTs) on the properties of Silicon Rubber (SR) composites. The ...

A new technical paper titled “Liquid Metal Fluidic Connection and Floating Die Structure for Ultralow Thermomechanical Stress of SiC Power Electronics Packaging” was published by researchers at ...